Header Ads

Core technology for ultra-small 3-D image sensor

6:51 AM , , ,
A KAIST research team developed a silicon optical phased array (OPA) chip, which can be a core component for three-dimensional image sensors. This research was co-led by Ph.D. candidate Seong-Hwan Kim and Dr. Jong-Bum You from the National Nanofab Center (NNFC).

from Engineering Technology News - Engineering News, Technology News, Technology, Engineering

Post a Comment

No comments

Subscribe to: Post Comments ( Atom )
Powered by Blogger.